In the latest episode of Commercial Baking’s TechTalk, Delkor’s Vice President of Operations, Kevin Weiss, dives into how the company continues to push the boundaries of packaging innovation. At the center of the conversation is the EVO Series Case Packer - a compact but powerful solution engineered to evolve alongside your business needs.
Despite its small footprint - just 5 feet long and 6 feet wide - EVO packs a serious punch. Each 5-foot cell is capable of running at speeds up to 70 cases per minute, making it one of the fastest case packers on the market. Its modular design and flexible configurations mean it can adapt seamlessly as consumer preferences and packaging formats shift. For manufacturers, that kind of adaptability is not just convenient, it’s essential for staying competitive in a rapidly changing market.
The discussion also highlights some of Delkor’s latest technology advancements designed to address longstanding industry challenges. One standout is the Trayfecta® X Series Former, which tackles the issue of warped corrugated material - one of the most frustrating and costly problems in case forming. With patented, laser-guided technology, the X Series Former delivers performance at up to 3X the PMMI industry standard. This breakthrough not only minimizes costly material waste but also ensures continuous production by eliminating the frequent downtime caused by warped board adjustments.
Another major innovation covered is Delkor’s patent-pending SmartLock™ technology, which takes the complexity out of machine changeovers. Instead of relying on trial and error, operators are guided by digital indicators that visually confirm adjustments. When the green light appears, the changeover point is perfectly aligned - making the process faster, simpler, and virtually error-proof.
Together, these solutions demonstrate how Delkor is reimagining packaging automation with equipment that is efficient, adaptable, and future-ready.
Tune into the full TechTalk episode to hear deeper insights on how these innovations are shaping the future of automated packaging.
